Senior Process Engineer

Role Summary

Develop, optimize, and qualify thin-film deposition processes supporting advanced packaging and wafer-level integration. The engineer will own film performance, uniformity, stress, adhesion, composition, defectivity, process stability, and integration with the overall packaging process flow.

Key Responsibilities

• Develop and optimize CVD, PECVD, and related thin-film deposition processes.

• Develop dielectric, passivation, barrier, liner, and other films used in advanced packaging.

• Optimize film thickness, uniformity, composition, stress, adhesion, and deposition rate.

• Establish and maintain robust deposition process windows.

• Troubleshoot particles, film non-uniformity, adhesion failures, contamination, chamber drift, and process excursions.

• Design and execute DOEs for process characterization and optimization.

• Establish SPC and process-control methodologies.

• Characterize deposited films using appropriate analytical and metrology techniques.

• Qualify new processes, materials, precursors, and equipment.

• Work closely with lithography, etch, CMP, plating, bonding, integration, metrology, and manufacturing teams.

• Support process transfer and manufacturing ramp.

Required Qualifications

• BS or MS in Materials Science, Chemical Engineering, Chemistry, Electrical Engineering, Applied Physics, or related field.

• 5+ years of semiconductor thin-film deposition or process-engineering experience.

• Hands-on experience with CVD, PECVD, PVD, ALD, or related deposition technologies.

• Strong understanding of thin-film deposition mechanisms and process chemistry.

• Experience controlling film thickness, uniformity, stress, adhesion, composition, and defectivity.

• Experience developing and optimizing semiconductor deposition recipes.

• Strong troubleshooting skills related to chamber performance, particles, film defects, and process excursions.

• Working knowledge of DOE, SPC, process capability, and root-cause analysis.

• Experience with semiconductor film characterization and metrology.

Preferred Qualifications

• Advanced packaging, wafer-level packaging, RDL, TSV, or heterogeneous-integration experience.

• Experience with SiN, SiO₂, passivation, dielectric, barrier, or seed-layer processes.

• Hybrid-bonding process experience.

• Process-integration experience across multiple semiconductor modules.

• Experience transferring thin-film processes into volume manufacturing.