Product Specialist - Flip Chip/Wire Bond

MANPOWER STAFFING SERVICES (SINGAPORE) PTE LTD

Date: 1 week ago

City: Singapore, Singapore

Salary: SGD 5,000 - SGD 8,000 / mo

Contract type: Full time

Process-Oriented Product Specialist who understands semiconductor packaging and bonding processes

Key skills

• Thermal Compression Bonding (TCB)

• Die Attach / Die Bonding

• Wire Bonding

• Flip Chip

• Advanced Packaging (SiP, WLCSP, BGA, QFN)

• Semiconductor Process Engineering

The role involves providing technical support to customers, troubleshooting process-related issues, collaborating with engineering teams, and supporting semiconductor assembly and packaging solutions across region.

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