Process & Application Engineer (Die-Bonding / Thermo Compression Bonding / Visual inspection)

EW ELITE SEARCH PTE. LTD.

Date: 2 weeks ago
City: Singapore, Singapore
Salary: SGD 5,000 - SGD 6,500 / mo
Contract type: Full time

Key Responsibilities

  • Process Setup: Program and optimize die-attach, eutectic, and thermo-compression bonding equipment.
  • Application Engineering: Evaluate customer requirements, run feasibility studies, and manage sample fabrication for New Product Introduction (NPI).
  • Quality & Inspection: Set up Automated Optical Inspection (AOI) programs and establish criteria to detect defects (voids, tilt, misalignment).
  • Yield Improvement: Use DOE and SPC to resolve process variations, perform root-cause failure analysis, and write SOPs.

Required Qualifications

  • Education: Degree in Mechanical, Electrical, Materials Engineering, or related fields.
  • Experience: 2+ years in semiconductor packaging or microelectronics assembly.
  • Technical Skills: Hands-on experience programming bonding equipment and automated vision/inspection systems.
  • Tools: Familiarity with failure analysis (shear testing, X-ray) and statistical software (Minitab/JMP).

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