TCB Product Manager

TCB Product Manager

Job Summary

We are seeking an experienced TCB (Thermal CompressionBonding) professional to lead the development of new TCB products whilemanaging a team of TCB Engineers and TCB Process Engineers. This role is bothhands-on and leadership-oriented: you will drive product and processdevelopment from concept to mass production, and you will build, mentor, andmanage a high-performing engineering team.

Key Responsibilities

A. New TCB Product & Process Development

• Lead the development of new TCB products, including process evaluation, process flow formulation, and module functional verification to ensure Design for Manufacturability (DFM).
• Drive the development and debugging of TCB process parameters (temperature, pressure, time, heating/cooling rates, etc.) and resolve critical process bottlenecks such as warpage control, coplanarity, and void rate.
• Evaluate and qualify new TCB materials, equipment, and consumables in collaboration with R&D, Quality, and Production teams.
• Lead NPI (New Product Introduction) projects, ensuring smooth transition from pilot run to mass production.
• Promote CIP (Continuous Improvement Plan) for major equipment and product abnormalities; lead Failure Analysis (FA) and issue improvement reports.
• Monitor process stability (Cpk/Ppk) and product yield; use data-driven methods to adjust processes and drive yield improvement.
• Develop and refine technical documentation, including PFD, SOP, OCAP, EFMEA, and inspection standards.

B. Team Management & Leadership

• Manage, mentor, and develop a team of TCB Engineers and TCB Process Engineers.
• Assign tasks, set priorities, and ensure project milestones are met on time and within budget.
• Conduct regular performance reviews, provide technical guidance, and support career development for team members.
• Foster a culture of collaboration, accountability, and continuous improvement.
• Coordinate team resources across multiple projects and ensure effective knowledge transfer and documentation.
• Interface with cross-functional teams (R&D, Quality, Production, Equipment) to align engineering resources with business objectives.

Qualifications

Education

• Bachelor’s degree or above in Electronics, Mechanical Engineering, Automation, Materials Science, Physics, Chemistry, or related fields.
• Master’s degree or above preferred.

Work Experience

• Minimum of 5–8 years of experience in TCB-related equipment and process development in semiconductor packaging, with at least 2 years in a team lead or supervisory role.
• Prior experience in 2.5D/3D advanced packaging and HBM stacking is highly preferred.
• Familiar with Thermal Compression Bonding (TCB) or Hybrid Bonding (HB) processes.

Professional Skills

• Proficient in operation, process debugging, and troubleshooting of mainstream TCB/FC equipment (e.g., ASM Firebird/Adept, Shibaura, K&S Aptura, Datacon, Hanmi, etc.).
• Deep understanding of thermal compression bonding mechanisms; experience with Fluxless bonding, Formic Acid reduction process, or Underfill process is highly preferred.
• Strong data analysis skills; proficient in JMP, Minitab, DOE, and yield analysis.
• Strong quality awareness and hands-on capabilities; able to work under pressure and handle overtime when necessary.
• Excellent communication, coordination, and teamwork skills.
• Proven ability to lead, motivate, and develop technical teams.

Preferred / Nice-to-Have

• Experience with advanced packaging technologies such as CoWoS, SoIC, or chiplet integration.
• Familiarity with customer-facing technical reviews and product qualification cycles.
• Experience in setting up new TCB process lines or transferring processes from R&D to production.

Working Conditions

• May require occasional overtime and travel to support production or customer requirements.
• Work primarily in engineering labs, cleanroom, and office environments.