Product Manager - Soft Solder/Sintering - Semiconductor

(max.10 tasks)

Technical Product Management

• Lead, coach and develop Product Line team members, including workload planning, performance feedback and competency development.
• Ensure Product Specialists maintain the technical expertise required to support demanding customer applications and requirements.
• Coordinate software feature planning, release priorities and product requirements with Engineering.
• Serve as the primary technical interface for Customer Project Managers regarding product capabilities, CERs and technical enquiries.
• Collaborate with Engineering to define solutions that meet customer-specific requirements.
• Gather, define and prioritize product requirements, CERs and CIP initiatives in line with customer needs, product strategy and business objectives.
• Contribute to product roadmaps and drive continuous improvement through market analysis, customer feedback, competitive benchmarking and machine capability assessments.
• Monitor product and machine performance, identifying and driving capability improvements where needed.
• Lead customer evaluations, demonstrations, benchmarking activities and process development projects.
Ensure availability of high-quality technical documentation, product updates and training materials for customers, CPMs, Service teams and FSEs

Pre- & After Sales Support

• Support CPMs and Sales during pre-sales activities with technical product know-how and application guidance.
• Establish technical customer relationships with the assigned key accounts.
Provide technical information, product updates and application feedback to CPMs, Service, Sales and Engineering Teams

Requirements

Education

Degree in engineering, Bachelor / Master or equivalent

Work experience

• Minimum 8 years of experience in a complex Technical environment, 5 years of experience in die attach applications, preferably soft soldering or Sintering processes.
• Experience in the semiconductor backend industry, ideally in product management, application engineering or project management.
• Good understanding of power semiconductor packaging (e.g. SiC, GaN, IGBT, MOSFET, power modules, DBC/AMB substrates, leadframe packages and advanced die attach processes)

Expertise and methodology

• Good PC, MS-Office knowledge

Other requirement criteria

• Excellent communication skills
• High level of assertiveness
• High degree of flexibility required
• Good behavior in customer relations
• MS-Office Intercultural understanding
• Travel readiness