Wafer Fab Process Engineer

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED

Date: 6 days ago
City: Singapore, Singapore
Salary: SGD 4,500 - SGD 9,000 / mo
Contract type: Full time

Job Summary

Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.

Key Responsibilities

  • Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).

  • Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.

  • Drive new process integration (NPI) and process transfer to high-volume manufacturing.

  • Perform root cause analysis and implement robust corrective/preventive actions.

  • Define process control plans, SPC strategies, and OCAP execution.

  • Collaborate cross-functionally with equipment, integration, quality, and R&D teams.

  • Mentor junior engineers and technicians.

  • Interface with suppliers on process and material improvements.

Qualifications

  • Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).

  • At least 5 years of semiconductor wafer fab process experience in thin film deposition - metal/passivation and/or thermal - oxidation, diffusion, implantation.

  • Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.

  • Demonstrated leadership in cross-functional technical projects.

  • Strong analytical, problem-solving, and communication skills

Preferred

  • PhD in Engineering (Electrical, Chemical, Materials, or related).

  • Six Sigma certification (Green/Black Belt).

  • Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.

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